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Semiconductor device fabrication
Results: 2185

#	Item
111	Management of Voids in Processing of Bonded Wafers Dr. Shari Farrens, Chief Scientist, EV Group Inc. Dr. Lawrence W. Kessler, President, Sonoscan, Inc. Abstract This paper discusses the origination and detection of bondi Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Microtechnology Acoustic microscopy Wafer Void Chemical-mechanical planarization Microfabrication Microelectromechanical systems Megasonic cleaning Photolithography Etching
112	Microsoft Word - Equipment Fabrication Policy FINAL Feb Add to Reading List Source URL: finance.caltech.edu Language: English Metal fabrication California Institute of Technology Semiconductor device fabrication Government procurement in the United States System on a chip Fabrication
113	UNITED STATES SECURITIES AND EXCHANGE COMMISSION WASHINGTON, D.C_____________________________ FORM 10-K Add to Reading List Source URL: www.tamartechnology.com Language: English - Date: 2015-04-28 13:04:29 Semiconductor device fabrication Rudolph Technologies Inc. Wafer Photolithography Stepper Three-dimensional integrated circuit Automated X-ray inspection Ellipsometry Integrated circuit KLA-Tencor
114	Produktblatt_CMP2016.indd Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-04-01 03:01:20 Semiconductor device fabrication Wafer KLA-Tencor Etching Applied Materials Silicon Saxony
115	「維基夥伴獎學金」獎助生成果報告書簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser：Prof. Edward Yi Chang Add to Reading List Source URL: diamondprj.nctu.edu.tw Language: English - Date: 2015-08-26 02:29:40 Semiconductor device fabrication Semiconductor devices Integrated circuits Monolithic microwave integrated circuit Packaging Reliability Integrated circuit packaging Integrated circuit Flip chip Gallium arsenide Transistor
116	Comparison of the growth kinetics of In2O3 and Ga2O3 and their suboxide desorption during plasma-assisted molecular beam epitaxy Patrick Vogt and Oliver Bierwagen Citation: Applied Physics Letters 109, ); doi Add to Reading List Source URL: www.pdi-berlin.de Language: English - Date: 2016-08-08 18:15:09 Oxides Semiconductor device fabrication Thin film deposition Surface science Desorption Gallium(III) oxide Suboxide Ultra-high vacuum Epitaxy
117	Fraunhofer IMS F RAU N HOF E R I NST I T U T E F O R M IC RO E L EC T RO N I C C I RCU I T S A N D SYS T E MS I MS Add to Reading List Source URL: www.ims.fraunhofer.de Language: English - Date: 2016-08-18 14:28:44 Semiconductor device fabrication Microtechnology Wafer Microelectromechanical systems Etching Integrated circuit Photoresist Cleanroom Stepper Deep reactive-ion etching Semiconductor fabrication plant Chemistry of photolithography
118	Microsoft Word - Prognostic Techniques for Deep Submicron Semiconductors[1]. Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:09 Survival analysis Failure Semiconductors Maintenance Semiconductor device fabrication Hot-carrier injection Reliability Electromigration MOSFET Prognostics Integrated circuit Failure rate
119	Nano Terra, Inc. 737 Concord Ave. Cambridge, MAMaterials Post-Doc Add to Reading List Source URL: www.nanoterra.com Language: English - Date: 2016-08-07 22:26:27 Nanotechnology Microfabrication Microtechnology Semiconductor device fabrication Engineering Materials science
120	2012 a nn ua l rep o r t a nd 2013 prox y chairm an ’ s le t t er By just about any measure, 2012 was a banner year for Rudolph. Notably, we ended the year with solid operating results: record yearly revenue of $218 m Add to Reading List Source URL: www.rudolphtech.com Language: English - Date: 2013-04-22 09:35:33 Semiconductor device fabrication Rudolph Technologies Inc. Wafer Photolithography Probe card Stepper Automated X-ray inspection Integrated circuit Embedded Wafer Level Ball Grid Array KLA-Tencor SUSS MicroTec

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